NUREMBERG, Germany, June 21-23rd, 2022 — At Embedded World 2022 Hall 1-241, BIWIN Technology LLC, Inc. showed its embedded memory and industrial solutions portfolio to meet increased demand for complex memory and storage needs at the intelligent edge.
The “edge” is everywhere and anywhere we are collecting, storing, managing and analyzing data. These days, with Internet of Things, that would include so many places: a sports field, power plant, your office building, an oil rig, a campus—even a battlefield. Or on your wrist as wearables become an everyday necessity for health and sport.
The “intelligent” edge because data from devices increasingly needs to be connected, computed and controlled at the edge — closer to where it is created — for actionable real-time insights. And these tasks require more powerful industrial-grade memory and storage, capable of processing massive data sets even in harsh conditions ruled by extreme temperatures, shock and vibrations, toxins, and unpredictable power supplies.
Edge devices now generate critical insights for everything from public safety to autonomous vehicles to manufacturing operations to smart building operations. And industry researchers and experts all agree we will see more and more connected devices with an increasing amount of applications as well as an increased need for faster storage and memory in larger and larger capacities.
To unlock new value for industries and drive the rapid innovation needed at the intelligent edge, BIWIN brought to Embedded World 2022 one of the industry’s largest product ranges in flash storage and memory.
Several of the popular solutions on the BIWIN stand in Hall 1 included:
The demands of the industrial market for massive data processing and high-performance computing will lead us to the faster adoption of DDR5 technology.
DDR5 is not just an upgrade to DDR4; DDR5 is a revolution with its dual-channel architecture, providing double the bandwidth. DDR5 unlocks new value for industry and businesses, driving the rapid innovation needed at the intelligent edge.
Compared with DDR4, the bank groups of DDR5 memory have doubled, allowing the memory to respond to execution actions at a faster speed and achieve ultra-high performance.
The standard operating voltage of DDR5 memory is reduced from DDR4’s 1.2V to just 1.1V, improving the power saving efficiency by 8% (and reducing and heat generation).
Instead of the traditional control method through the motherboard, the DDR5 memory is equipped with a power management IC (PMIC), which can control the system power load more efficiently and improve the power conversion efficiency by 85%. This improves signal integrity and compatibility, and even reduces the cost of the motherboard design for power supply.
BIWIN DDR5 U-DIMM is a low power consumption, high-performance memory module that fully conforms to JEDEC’s 288-pin DDR5. This series of products use 1.1 V operating voltage and can face ambient temperature ranges from 0℃ to 85℃. With 16GB to 32GB of DIMM capacities, the data transfer rate is up to 4800 MT/s. The DRAM ICs used in this series of products are strictly screened to ensure stable operation and strong compatibility, making the products the best choice for industrial control, security and protection, desktop PCs and more.
BIWIN DDR5 SO-DIMM is a low-power, high-performance product that fully conforms to JEDEC’s 262pin DDR5 small size memory module. This series of products use a working voltage of 1.1 V and their applicable operating temperature range is from 0℃ to 85℃. With a capacity range of 16GB – 32GB with up to 4800 MT/s data transfer speed, DDR5 SO-DIMM fits computer and gaming laptops, NUCs, thin client, security and protection and more.
With a wide range of embedded storage solutions for different industries, BIWIN visitors could find a solution that matches their industry, and their product needs.
The new BIWIN BGA SSD EP-300 is an amazingly small SSD form factor (11.5x 13 mm x 1.6mm) with the power of a fuller-size SSD. Leveraging the PCIe 3.0 x2 interface, this dual-channel TLC flash chip allows 1700 MB/s read/1100MBs write. This single-chip SSD is great for industrial field solutions, vehicle electronics, ultrathin laptops, gaming notebooks, and ruggedized computers.
BIWIN ePOP (available in different capacities) combines MMC and Mobile LPDDR in a single package. With leading wafer packaging technologies, including wafer grinding, lamination and lead bonding, BIWIN integrates RAM and ROM in a single device that not only improves performance and is more energy-efficient, but also saves printed circuit board space (PCB) and shortens the development period for customers. BIWIN ePOP products are small in size, low in power consumption, low in cost and easy to develop, making them ideal solutions for smart wearables, IoT devices, and portable and handheld devices (such as smartphones, tablets, PMP, PDAs and other media devices).
BIWIN eMCP, using our decades of experience in chip packaging and our state-of-the-art afcility, integrates an eMMC chip and a low-power DRAM solution (adhering to a JEDEC standard protocol). This simplifies our customer’s device manufacturing process and development cost, shortens the development time, and speeds up the launch of the products. The data transmission rate of this series of products can reach 4266 MT/s. Compared with traditional MCP, eMCP uses a built-in NAND flash control chip which reduces the burden of main chip computing and manage larger capacity Flash memory.
These innovative BIWIN storage products, purpose-built for industrial or embedded applications, help businesses generate more value
BIWIN Storage Technology Company Limited produces high quality flash storage and is now known in consumer, corporate and industrial segments for its independent development capabilities in hardware, software, firmware and storage algorithms.
BIWIN’s experience in production (along with its complete packaging, testing, and production lines) ensures BIWIN products are superior in performance, earning BIWIN many awards and a reputation for providing global customers with high-quality storage products.
At the end of 2021, the company opened its latest facility, BIWIN Huizhou Science and Technology Zone, with a state-of-the-art R&D lab and 110,000 m2 of production.
Our founders started in the flash storage business in Shenzhen, China in 1995, embracing the “WIN-WIN” business philosophy that would later become the hallmark for BIWIN. In 2009 they made a key decision for the business: to add IC encapsulation (or IC packaging) process into the factory. A remarkable milestone that vast of majority of competing companies still don’t have (they outsource the process or buy the packaged IC packaged). This successful step led to the 2010 creation of the company we know today, BIWIN Storage Technology Company. To learn more about BIWIN Technology visit http://www.biwintechnology.com
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