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Embedded Chips

Embedded Storage

BIWIN UFS

As a next-generation embedded memory chip, the BIWIN UFS is three times faster than the latest eMMC 5.1 standard. With the high-performance UFS 2.1 interface, BIWIN UFS effectively ensures data transfer security without lag in reading and writing operations, as well as lower power consumption.

Examples of Applications

Mobile Phone
Mobile Phone
Educational Device
Action Camera icon
GoPro
UAV icon
UAV
Pancam icon
Pancam
Biwin Product
Interface
UFS 2.1
UFS 2.1
Dimensions
UFS 2.1
11.5 x 13.0 x 0.9 mm / 11.5 x 13.0 x 1.0 mm
Package
UFS 2.1
LFBGA153b
Capacity
UFS 2.1
64 GB / 128 GB / 256 GB
Max. Sequential Read (MB/s)
UFS 2.1
750 / 850 / 900 MB/s
Max. Sequential Write (MB/s)
UFS 2.1
250 / 300 / 300 MB/s
Working Voltage
UFS 2.1
VCCQ = 1.8 V, VCCQ2 = 1.2 V, VCC = 3.3 V, VCC = 2.5 V
Working Temperature
UFS 2.1
Consumer grade: -20 ℃ - 85 ℃
Biwin Product
Interface
UFS 2.2
UFS 2.2
Dimensions
UFS 2.2
11.5 x 13.0 x 0.9 mm / 11.5 x 13.0 x 1.0 mm
Package
UFS 2.2
LFBGA153b
Capacity
UFS 2.2
64 GB / 128 GB / 256 GB
Max. Sequential Read (MB/s)
UFS 2.2
750 / 850 / 900 MB/s
Max. Sequential Write (MB/s)
UFS 2.2
250 / 300 / 300 MB/s
Working Voltage
UFS 2.2
VCCQ = 1.8 V, VCCQ2 = 1.2 V, VCC = 3.3 V, VCC = 2.5 V
Working Temperature
UFS 2.2
Consumer grade: -20 ℃ - 85 ℃
Biwin Product
Interface
UFS 3.1
UFS 3.1
Dimensions
UFS 3.1
11.5 x 13.0 x 0.9 mm / 11.5 x 13.0 x 1.0 mm / 11.5 x 13.0 x 1.1 mm
Package
UFS 3.1
LFBGA153b
Capacity
UFS 3.1
128 GB / 256 GB / 512 GB
Max. Sequential Read (MB/s)
UFS 3.1
1800 / 2000/ 2100 MB/s
Max. Sequential Write (MB/s)
UFS 3.1
800 / 1150 / 1200 MB/s
Working Voltage
UFS 3.1
VCCQ = 1.8 V, VCCQ2 = 1.2 V, VCC = 3.3 V, VCC = 2.5 V
Working Temperature
UFS 3.1
Consumer grade: -20 ℃ - 85 ℃

We are here to answer any question you may have.

BIWIN TECHNOLOGY LLC

8725 NW 18th Terrace

Suite #401

Miami FL 33172

United States

Tax ID number: 83-4697474

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