Miami, U.S.A., July 26th, 2022 — At Flash Memory Summit 2022 on Booth 619, BIWIN Storage Technology Co., Ltd. will show its wide-ranging embedded memory and industrial solutions portfolio designed to meet the increased demand for complex memory and storage needs.
Flash Memory Summit showcases the mainstream applications, key technologies, leading vendors, and innovative startups driving the multi-billion-dollar non-volatile memory and SSD markets.
Non-volatile memory and SSD business will continue to experience substantial growth fueled by the digital transformation of enterprises, Industry 4.0, the rise of millions of consumer content creators, and the beginning of the metaverse as a computer interface.
Also, the unprecedented trillion-dollar global growth in the Internet of Things (IoT) triggers an evolution in new technology with a particular focus on collecting, storing, managing, and analyzing data. The evolution requires more powerful industrial-grade memory and storage, customized embedded solutions, and even some storage capable of processing massive data sets despite harsh conditions where extreme temperatures, shock and vibrations, toxins, and unpredictable power supplies rule the environment.
At FMS 2022, BIWIN’s innovative storage solutions will cover enterprise server system SSDs, in-vehicle SSDs, industrial DDR5, Gen4 BGA SSDs, and embedded memory chips.
Several of the popular INDUSTRIAL SOLUTIONS on the BIWIN stand in Booth 619 will be:
For Enterprise Server: BIWIN SSD SS321 is a pioneering product built with 3D NAND wafer bundled with a SATA 6 Gbps interface and DDR4 external DRAM cache. It delivers a maximum sequential 560MB/s read and 500MB/s write. Available in 240GB, 480GB, and 960GB.
For In-vehicle: BIWIN C1004 is specially manufactured for car monitoring system of NVR/DVR. To cope with the severe challenges, such as frequent outages, unstable voltage, large temperature differential, large capacity for data storage, strong vibration, and huge interference, C1004 adopts the SATA interface. With a maximum capacity of up to 1.92TB, it boasts the functions of over-temperature protection, high-and-low temperature resistance, firmware backup, SMART monitoring, power-off protection, V-REC algorithm optimization, and more.
The demands of the industrial market for massive data processing and high-performance computing will lead us to the faster adoption of DDR5 technology.
DDR5 is not just an upgrade to DDR4; DDR5 is a revolution with its dual-channel architecture, providing double the bandwidth. DDR5 unlocks new value for industry and businesses, driving the rapid innovation needed at the intelligent edge.
Compared with DDR4, the bank groups of DDR5 memory have doubled, allowing the memory to respond to execution actions at a faster speed and achieve ultra-high performance.
The standard operating voltage of DDR5 memory is reduced from DDR4’s 1.2V to just 1.1V, improving the power saving efficiency by 8% (and reducing heat generation).
Instead of the traditional control method through the motherboard, the DDR5 memory is equipped with a power management IC (PMIC), which can control the system power load more efficiently and improve the power conversion efficiency by 85%. This improves signal integrity and compatibility, and even reduces the cost of the motherboard design for power supply.
BIWIN DDR5 U-DIMM is a low power consumption, high-performance memory module that fully conforms to JEDEC’s 288-pin DDR5. This series of products use 1.1V operating voltage and can face ambient temperature ranges from 0℃ to 85℃. With 16GB to 32GB of DIMM capacities, the data transfer rate is up to 4800MT/s. The DRAM ICs used in this series of products are strictly screened to ensure stable operation and strong compatibility, making the products the best choice for industrial control, security and protection, desktop PCs and more.
BIWIN DDR5 SO-DIMM is a low-power, high-performance product that fully conforms to JEDEC’s 262pin DDR5 small size memory module. This series of products use a working voltage of 1.1V and their applicable operating temperature range is from 0℃ to 85℃. With a capacity range of 16GB – 32GB with up to 4800 MT/s data transfer speed, DDR5 SO-DIMM fits computer and gaming laptops, NUCs, thin clients, security and protection devices, and more.
With a wide range of embedded memory chips for different industries, BIWIN visitors will find a solution that matches their industry, and their product needs.
The new BIWIN BGA SSD EP400 is designed to help customers become trendsetters in flagship intelligent terminal applications. Coupled with PCIe Gen 4 x 2 interface and NVMe 1.4 protocol, EP400 delivers unrivaled speed up to 3500 MB/s. With the same size as eMMC and UFS, the read and write speeds of EP400 are twice that of PCIe 3.0 BGA SSD E009 series and much higher than UFS 3.0/3.1 products. It boasts comprehensive edges in flagship mobile smart terminals and is an excellent choice for 2-in-1 laptops, flagship smartphones, autonomous driving, drones, and other applications.
BIWIN ePOP254 (available in different capacities) combines MMC and Mobile LPDDR in a single package. With leading wafer packaging technologies, including wafer grinding, lamination and lead bonding, BIWIN integrates RAM and ROM in a single device that not only improves performance and is more energy-efficient, but also saves printed circuit board space (PCB) and shortens the development period for customers. BIWIN ePOP products are small in size, low in power consumption, low in cost and easy to develop, making them ideal solutions for smart wearables, IoT devices, and portable and handheld devices (such as smartphones, tablets, PMP, PDAs and other media devices).
BIWIN eMCP144, using our decades of experience in chip packaging and our state-of-the-art facilities, integrates an eMMC chip and a low-power DRAM solution (adhering to a JEDEC standard protocol). This simplifies our customer’s device manufacturing process and development cost, shortens the development time, and speeds up the launch of the products. The data transmission rate of this series of products can reach 4266 MT/s. Compared with traditional MCP, eMCP uses a built-in NAND flash control chip which reduces the burden of main chip computing and manages larger capacity Flash memory.
BIWIN Storage Technology Company Limited produces high-quality flash storage and is now known in consumer, corporate and industrial segments for its independent development capabilities in hardware, software, firmware and storage algorithms.
BIWIN’s experience in production (along with its complete packaging, testing, and production lines) ensures BIWIN products are superior in performance, earning BIWIN many awards and a reputation for providing global customers with high-quality storage products.
At the end of 2021, the company opened its latest 110,000 m2 facility, BIWIN Huizhou Science and Technology Zone, with a state-of-the-art R&D lab and production.
Our founders started in the flash storage business in Shenzhen, China in 1995, embracing the “WIN-WIN” business philosophy that would later become the hallmark for BIWIN. In 2009 they made a key decision for the business: to add IC encapsulation (or IC packaging) process into the factory. A remarkable milestone that vast of majority of competing companies still don’t have these resources (they outsource the process or buy ICs already packaged). This successful step led to the 2010 creation of the company we know today, BIWIN Storage Technology company.
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