logo

Embedded Chips

Embedded Storage

BIWIN uMCP

This is a next-generation mobile storage solution based on UFS and LPDDR4. It offers compact construction (so your smart devices can be even smaller) and excellent performance. It brings ultra-low power consumption, efficient power management and energy-savings, environmental protection, and a longer standby time. You can trust its performance distinguished by low electromagnetic interference to ensure more dependable operation. 

The combination of UFS plus LPDDR4 ensures a high transmission rate and we’re convinced uMCP will become the next generation storage solution and replace traditional eMCP.

Examples of Applications

Mobile Phone
Mobile Phone
Wearable Device
Educational Device
Gaming
Gaming
Tablet
Tablet
Navigation Icon
Navigation
Wearable Device
Wearable Device
Biwin Product
Interface
UFS 2.2
UFS 2.2
LPDDR4X
LPDDR4X ( Up to 1866 MHz / 3733 Mbps )
Dimensions
UFS 2.2
11.5 x 13.0 x 0.9 mm
UFS 2.2~LPDDR4X
11.5 x 13.0 x 1.0 mm
LPDDR4X
11.5 x 13.0 x 1.1 mm
Package
UFS 2.2
UFS 2.2~LPDDR4X
FBGA254
LPDDR4X
Capacity
UFS 2.2
64 GB + 4 Gb
UFS 2.2~LPDDR4X
128 GB + 6 Gb
LPDDR4X
256 GB + 8 Gb
Max. Sequential Read (MB/s)
UFS 2.2
750 MB/s
UFS 2.2~LPDDR4X
850 MB/s
LPDDR4X
900 MB/s
Max. Sequential Write (MB/s)
UFS 2.2
250 MB/s
UFS 2.2~LPDDR4X
300 MB/s
LPDDR4X
300 MB/s
Working Voltage
UFS 2.2
VCCQ = 1.8 V, VCC = 3.3 V
UFS 2.2~LPDDR4X
VDD1 = 1.8 V, VDDR2 = 1.1 V, VDDQ = 0.6 V
Working Temperature
UFS 2.2
UFS 2.2~LPDDR4X
-20 ℃ - 85 ℃
LPDDR4X

We are here to answer any question you may have.

BIWIN TECHNOLOGY LLC

8725 NW 18th Terrace

Suite #401

Miami FL 33172

United States

Tax ID number: 83-4697474

Contact us