Embedded Chips

Solving the higher cost of mobile storage with NAND flash with an LPDDR2/3 solution, nMCP features a smaller size, higher capacities, and lower power consumption. By stacking the NAND flash and using low-power SRAM, we release more PCB space. The stacked die can achieve higher performance, better integration, and yet a lower power consumption.

Save budget as well as space: nMCP is more efficient than the single chip encapsulation and the cost is lower than the independent chip combination.