BIWIN ePOP combines eMMC and Mobile LPDDR in one package with optional capacities. ePOP is widely used in applications in mobile and wearables. With the leading wafer packaging technology (advanced wafer grinding, lamination and wirebonding), BIWIN integrates RAM and ROM in a device. It improves performance and energy efficiency, saves space on printed circuit boards (PCB), and reduces production cycle.
Thanks to these characteristics in a small form factor, with low-power and a cost-saving development process, BIWIN ePOP is an ideal solution for portable and wearable devices such as smartphones, tablets, PMPs, PDAs and other media devices.
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8725 NW 18th Terrace
Miami FL 33172
Tax ID number: 83-4697474