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Embedded Chips

Embedded Storage

BIWIN ePOP

BIWIN ePOP combines eMMC and Mobile LPDDR in one package with optional capacities. ePOP is widely used in applications in mobile and wearables. With the leading wafer packaging technology (advanced wafer grinding, lamination and wirebonding), BIWIN integrates RAM and ROM in a device. It improves performance and energy efficiency, saves space on printed circuit boards (PCB), and reduces production cycle. 

Thanks to these characteristics in a small form factor, with low-power and a cost-saving development process, BIWIN ePOP is an ideal solution for portable and wearable devices such as smartphones, tablets, PMPs, PDAs and other media devices.

Examples of Applications

Wearable Device
Educational Device
Wearable Device
Wearable Device
Biwin Product
Interface
eMMC 5.0
eMMC 5.0
LPDDR3
LPDDR3 (Up to 933 MHz / 1866 Mbps)
Dimensions
eMMC 5.0
10 x 10 x 0.9 mm
LPDDR3
10 x 10 x 0.9 mm
Package
eMMC 5.0
4 GB + 4 Gb / 4 GB + 8 Gb
LPDDR3
8 GB + 4 Gb / 8 GB + 8 Gb
Capacity
eMMC 5.0
100 MB/s
LPDDR3
125 MB/s
Max. Sequential Read (MB/s)
eMMC 5.0
100 MB/s
LPDDR3
125 MB/s
Max. Sequential Write (MB/s)
eMMC 5.0
45 MB/s
LPDDR3
100 MB/s
Working Voltage
eMMC 5.0
VCC = 3.3 V,
VCCQ = 1.8 V
LPDDR3
VDD1 = 1.8 V, VDD2 = 1.2 V,
VDDCA = 1.2 V, VDDQ = 1.2 V
Working Temperature
eMMC 5.0
Consumer grade: -20 ℃ - 85 ℃
LPDDR3
Consumer grade: -20 ℃ - 85 ℃
Biwin Product
Interface
eMMC 5.0
eMMC 5.0
LPDDR3
LPDDR3 (Up to 933 MHz / 1866 Mbps)
Dimensions
eMMC 5.0
12 x 10 x 0.9 mm
LPDDR3
12 x 10 x 0.9 mm
Package
eMMC 5.0
FBGA136
LPDDR3
FBGA136
Capacity
eMMC 5.0
16 GB + 16 Gb
LPDDR3
16 GB + 16 Gb
Max. Sequential Read (MB/s)
eMMC 5.0
229 MB/s
LPDDR3
229 MB/s
Max. Sequential Write (MB/s)
eMMC 5.0
113 MB/s
LPDDR3
113 MB/s
Working Voltage
eMMC 5.0
VCC = 3.3 V,
VCCQ = 1.8 V
LPDDR3
VDD1 = 1.8 V, VDD2 = 1.2 V,
VDDCA = 1.2 V, VDDQ = 1.2 V
Working Temperature
eMMC 5.0
Consumer grade: -20 ℃ - 85 ℃
LPDDR3
Consumer grade: -20 ℃ - 85 ℃
Biwin Product
Interface
eMMC 5.1
eMMC 5.1
LPDDR4X
LPDDR4X (Up to 1866 MHz / 3733 Mbps)
Dimensions
eMMC 5.1
12 x 13 x 0.7 mm
LPDDR4X
12 x 13 x 0.7 mm
Package
eMMC 5.1
FBGA320
LPDDR4X
FBGA320
Capacity
eMMC 5.1
16 GB + 8 Gb / 16 GB + 16 Gb / 32 GB + 16 Gb
LPDDR4X
16 GB + 8 Gb / 16 GB + 16 Gb / 32 GB + 16 Gb
Max. Sequential Read (MB/s)
eMMC 5.1
230 MB/s
LPDDR4X
230 MB/s
Max. Sequential Write (MB/s)
eMMC 5.1
120 MB/s
LPDDR4X
120 MB/s
Working Voltage
eMMC 5.1
VCC = 3.3 V,
VCCQ = 1.8 V
LPDDR4X
VDD1 = 1.8 V, VDD2 = 1.1 V,
VDDCA = 1.1 V, VDDQ = 1.1 V
Working Temperature
eMMC 5.1
Consumer grade: -20 ℃ - 85 ℃
LPDDR4X
Consumer grade: -20 ℃ - 85 ℃
Biwin Product
Interface
eMMC 5.1
eMMC 5.1
LPDDR4X
LPDDR4X (Up to 1866 MHz / 3733 Mbps)
Dimensions
eMMC 5.1
12 x 13 x 0.7 mm
LPDDR4X
12 x 13 x 0.7 mm
Package
eMMC 5.1
FBGA144
LPDDR4X
FBGA144
Capacity
eMMC 5.1
16 GB + 8 Gb / 16 GB + 16 Gb / 32 GB + 16 Gb
LPDDR4X
16 GB + 8 Gb / 16 GB + 16 Gb / 32 GB + 16 Gb
Max. Sequential Read (MB/s)
eMMC 5.1
230 MB/s
LPDDR4X
230 MB/s
Max. Sequential Write (MB/s)
eMMC 5.1
120 MB/s
LPDDR4X
120 MB/s
Working Voltage
eMMC 5.1
VCC = 3.3 V,
VCCQ = 1.8 V
LPDDR4X
VDD1 = 1.8 V, VDD2 = 1.1 V,
VDDCA = 1.1 V, VDDQ = 1.1 V
Working Temperature
eMMC 5.1
Consumer grade: -20 ℃ - 85 ℃
LPDDR4X
Consumer grade: -20 ℃ - 85 ℃

We are here to answer any question you may have.

BIWIN TECHNOLOGY LLC

8725 NW 18th Terrace

Suite #401

Miami FL 33172

United States

Tax ID number: 83-4697474

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