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Products & Services

For almost any application and industry, we can offer you our embedded flash memory products — or our custom IC packaging service

Embedded Chips

BIWIN provides customers worldwide with embedded memory products (eMMC, LPDDR, eMCP, SPI NAND, ePOP and more) as well as design-in services.

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eMMC

eMMC is an embedded non-volatile memory system (flash memory and controller) that frees the host processor from low-level flash memory management. For product developers, this simplifies the application interface design and qualification process to reduce the time-to-market. Designed for a wide range of applications (consumer electronics, mobile phones, handheld computers, navigational systems, etc), the small BGA package sizes and low power consumption make eMMC an excellent low-cost memory solution for any space-constrained applications such as mobile devices.

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eMCP

With the increasing development of smartphone operating systems and applications, mobile phones have higher requirements for larger storage capacity. BIWIN’s eMCP is based on MCP (Multi-Chip Packaging), which integrates an eMMC chip and a low-power DRAM into one IC package.

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ePOP

BIWIN ePOP combines eMMC and Mobile LPDDR in one package with optional capacities. ePOP is widely used in applications in mobile and wearables. With the leading wafer packaging technology (advanced wafer grinding, lamination and wirebonding), BIWIN integrates RAM and ROM in a device.

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uMCP

This is a next-generation mobile storage solution based on UFS and LPDDR4. It offers compact construction (so your smart devices can be even smaller) and excellent performance.

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BGA SSD

Our ball-grid-array (BGA) embedded SSD technology packs NAND flash, DRAM memory, and a controller chip into a package that weighs less than half a penny and is smaller than a postage stamp.

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UFS

As a next-generation embedded memory chip, the BIWIN UFS is three times faster than the latest eMMC 5.1 standard. With the high-performance UFS 2.1 interface, BIWIN UFS effectively ensures data transfer security without lag in reading and writing operations, as well as lower power consumption.

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DDR

With a higher transfer rate compared to SDRAM, BIWIN DDR (Double Data Rate) memory provides high-performance RAM solutions from DDR1 to DDR4, meeting the growing requirements of storage for internet routers, vehicles, and other commercial electronics.

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LPDDR

LPDDR (Low-Power Double Data Rate), also known as LPDDR SDRAM, is a type of synchronous dynamic random-access memory that consumes less power.

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Industrial Control Storage

BIWIN provides several state-of-the-art series of cache-less and cost-effective storage for industrial control applications.

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SATA 2.5''

BIWIN's IPC A Series is built for entry-level industrial control. The A Series offers cacheless and cost-effective solutions for industrial control applications with optimized firmware algorithms and hardware circuit design to ensure the reliability and long-term operational stability.

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SATA M.2

BIWIN's IPC A Series is built for entry-level industrial control. The A Series offers cacheless and cost-effective solutions for industrial control applications with optimized firmware algorithms and hardware circuit design to ensure the reliability and long-term operational stability.

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NVMe M.2

BIWIN's IPC A Series is built for entry-level industrial control. The A Series offers cacheless and cost-effective solutions for industrial control applications with optimized firmware algorithms and hardware circuit design to ensure the reliability and long-term operational stability.

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mSATA

BIWIN's IPC A Series is built for entry-level industrial control. The A Series offers cacheless and cost-effective solutions for industrial control applications with optimized firmware algorithms and hardware circuit design to ensure the reliability and long-term operational stability.

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DDR4

BIWIN uses its own exclusive memory testing technology to provide a series of DRAM products for long-term use with high stability, wide compatibility, high read-write performance, and excellent compatibility with mainstream computing platform solutions.

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DDR5 (Coming)

The latest generation of DDR, with a new architecture for a big jump in performance.

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CFast Card

Designed for photo and video professionals with stringent requirements for reliability, performance and storage capacity, the BIWIN memory cards are based on a new generation of high performance cameras and camcorders, providing professional excellence in speed and capacity for full HD recording specifications, and supporting 4K HD video recording.

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CFexpress Card

Designed for photo and video professionals with stringent requirements for reliability, performance and storage capacity, the BIWIN memory cards are based on a new generation of high performance cameras and camcorders, providing professional excellence in speed and capacity for full HD recording specifications, and supporting 4K HD video recording.

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USB DOM

DOM series solid state drives provide high performance and reliable data storage services. They can store data safely and stably, even in harsh application environments such as high and low temperatures, high impacts, strong vibrations, and interferences, etc.

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IC Packaging & Testing Services

With more than 1 billion packaged ICs and a yield rate of more than 99.7%, BIWIN should be your first choice for projects.

Our new state-of-the-art manufacturing facilities allow for mass production with advanced multi-die stacking packaging technology as well as advanced memory testing equipment. Our BIWIN experience sets a high standard for quality control and product reliability testing. Ask us about our 16-layer die-stacking technology.

We are here to answer any question you may have.

BIWIN TECHNOLOGY LLC

8725 NW 18th Terrace

Suite #401

Miami FL 33172

United States

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