Products & Services
For almost any application and industry, we can offer you our embedded flash memory products — or our custom IC packaging service
Embedded Chips
BIWIN provides customers worldwide with embedded memory products (eMMC, LPDDR, eMCP, SPI NAND, ePOP and more) as well as design-in services.
eMMC
eMMC is an embedded non-volatile memory system (flash memory and controller) that frees the host processor from low-level flash memory management. For product developers, this simplifies the application interface design and qualification process to reduce the time-to-market. Designed for a wide range of applications (consumer electronics, mobile phones, handheld computers, navigational systems, etc), the small BGA package sizes and low power consumption make eMMC an excellent low-cost memory solution for any space-constrained applications such as mobile devices.
eMCP
With the increasing development of smartphone operating systems and applications, mobile phones have higher requirements for larger storage capacity. BIWIN’s eMCP is based on MCP (Multi-Chip Packaging), which integrates an eMMC chip and a low-power DRAM into one IC package.
ePOP
BIWIN ePOP combines eMMC and Mobile LPDDR in one package with optional capacities. ePOP is widely used in applications in mobile and wearables. With the leading wafer packaging technology (advanced wafer grinding, lamination and wirebonding), BIWIN integrates RAM and ROM in a device.
uMCP
This is a next-generation mobile storage solution based on UFS and LPDDR4. It offers compact construction (so your smart devices can be even smaller) and excellent performance.
nMCP
Solving the higher cost of mobile storage with NAND flash with an LPDDR2/3 solution, nMCP features a smaller size, higher capacities, and lower power consumption. By stacking the NAND flash and using low-power SRAM, we release more PCB space.
BGA SSD
Our ball-grid-array (BGA) embedded SSD technology packs NAND flash, DRAM memory, and a controller chip into a package that weighs less than half a penny and is smaller than a postage stamp.
UFS
As a next-generation embedded memory chip, the BIWIN UFS is three times faster than the latest eMMC 5.1 standard. With the high-performance UFS 2.1 interface, BIWIN UFS effectively ensures data transfer security without lag in reading and writing operations, as well as lower power consumption.
DDR
With a higher transfer rate compared to SDRAM, BIWIN DDR (Double Data Rate) memory provides high-performance RAM solutions from DDR1 to DDR4, meeting the growing requirements of storage for internet routers, vehicles, and other commercial electronics.
LPDDR
LPDDR (Low-Power Double Data Rate), also known as LPDDR SDRAM, is a type of synchronous dynamic random-access memory that consumes less power.
Industrial Control Storage
BIWIN provides several state-of-the-art series of cache-less and cost-effective storage for industrial control applications.
SATA 2.5''
BIWIN's IPC A Series is built for entry-level industrial control. The A Series offers cacheless and cost-effective solutions for industrial control applications with optimized firmware algorithms and hardware circuit design to ensure the reliability and long-term operational stability.
SATA M.2
BIWIN's IPC A Series is built for entry-level industrial control. The A Series offers cacheless and cost-effective solutions for industrial control applications with optimized firmware algorithms and hardware circuit design to ensure the reliability and long-term operational stability.
NVMe M.2
BIWIN's IPC A Series is built for entry-level industrial control. The A Series offers cacheless and cost-effective solutions for industrial control applications with optimized firmware algorithms and hardware circuit design to ensure the reliability and long-term operational stability.
mSATA
BIWIN's IPC A Series is built for entry-level industrial control. The A Series offers cacheless and cost-effective solutions for industrial control applications with optimized firmware algorithms and hardware circuit design to ensure the reliability and long-term operational stability.
DDR4
BIWIN uses its own exclusive memory testing technology to provide a series of DRAM products for long-term use with high stability, wide compatibility, high read-write performance, and excellent compatibility with mainstream computing platform solutions.
DDR5 (Coming)
The latest generation of DDR, with a new architecture for a big jump in performance.
CFast Card
Designed for photo and video professionals with stringent requirements for reliability, performance and storage capacity, the BIWIN memory cards are based on a new generation of high performance cameras and camcorders, providing professional excellence in speed and capacity for full HD recording specifications, and supporting 4K HD video recording.
CFexpress Card
Designed for photo and video professionals with stringent requirements for reliability, performance and storage capacity, the BIWIN memory cards are based on a new generation of high performance cameras and camcorders, providing professional excellence in speed and capacity for full HD recording specifications, and supporting 4K HD video recording.
SATA DOM
DOM series solid state drives provide high performance and reliable data storage services. They can store data safely and stably, even in harsh application environments such as high and low temperatures, high impacts, strong vibrations, and interferences, etc.
USB DOM
DOM series solid state drives provide high performance and reliable data storage services. They can store data safely and stably, even in harsh application environments such as high and low temperatures, high impacts, strong vibrations, and interferences, etc.
SSD
SATA 2.5''
SATA M.2
NVMe M.2
mSATA
Memory
DDR4
DDR5 (Coming)
Memory Card
CFast Card
CFexpress Card
DOM Series
SATA DOM
USB DOM
IC Packaging & Testing Services
With more than 1 billion packaged ICs and a yield rate of more than 99.7%, BIWIN should be your first choice for projects.
Our new state-of-the-art manufacturing facilities allow for mass production with advanced multi-die stacking packaging technology as well as advanced memory testing equipment. Our BIWIN experience sets a high standard for quality control and product reliability testing. Ask us about our 16-layer die-stacking technology.
We are here to answer any question you may have.
BIWIN TECHNOLOGY LLC
8725 NW 18th Terrace
Suite #400
Miami FL 33172
United States
Phone: 1-305-456-3288