Embedded Chips
Embedded Storage
BIWIN BGA SSD
Our ball-grid-array (BGA) embedded SSD technology packs NAND flash, DRAM memory, and a controller chip into a package that weighs less than half a penny and is smaller than a postage stamp. Yet, the performance of this tiny SSD powerhouse is up to 1500 times a typical PC hard-disk drive. With premium NAND flash and a quality controller, BIWIN BGA SSD provides higher speed while offering lower power consumption, data protection, and better durability (including temperature resistance, shock- and vibration-proofing).
Examples of Applications
Notebook
Model
ES200
ES200
Controller
ES200
SM2258XT
Flash
ES200
TLC
Interface
ES200
SATA III
Capacity
ES200
64 GB - 256 GB
Max. Number of Channels
ES200
4
Package
ES200
BGA157
Max. Sequential Read / Write (MB/s)
ES200
409 / 326
Max. Power Consumption
ES200
1.35 W
Temperature Alert & Protection
ES200
YES
Firmware Upgrade
ES200
YES
TRIM & NCQ
ES200
YES
S.M.A.R.T. Monitor
ES200
YES
AES 256-Bit
ES200
YES
Working Temperature
ES200
-20 ℃ - 70 ℃
Storage Temperature
ES200
-40 ℃ - 85 ℃
Dimensions
ES200
16 x 20 x 1.6 mm
Model
EP300
EP300
Controller
EP300
IG5208
Flash
EP300
TLC
Interface
EP300
PCIe 3 x 4
Capacity
EP300
128 GB - 256 GB
Max. Number of Channels
EP300
4
Package
EP300
BGA345
Max. Sequential Read / Write (MB/s)
EP300
1700 / 1100
Max. Power Consumption
EP300
3.5 W
Temperature Alert & Protection
EP300
YES
Firmware Upgrade
EP300
YES
TRIM & NCQ
EP300
YES
S.M.A.R.T. Monitor
EP300
YES
AES 256-Bit
EP300
//
Working Temperature
EP300
0 ℃ - 70 ℃
Storage Temperature
EP300
-40 ℃ - 85 ℃
Dimensions
EP300
11.5 x 13 x 1.6 mm
We are here to answer any question you may have.
BIWIN TECHNOLOGY LLC
8725 NW 18th Terrace
Suite #400
Miami FL 33172
United States
Phone: 1-305-456-3288
Tax ID number: 83-4697474