BIWIN offers storage solutions for many applications throughout many industries — and Industry 4.0 can also count on our experience for their special industrial applications. You can find BIWIN embedded solutions in many of the most famous devices that define our digital era. Customers appreciate the "win-win" philosophy that drives our solutions business.
BIWIN offers many types of IC packaging, including BGA, SIP, LAG, QFN, TSOP and more.
Integrated circuit packaging is the final stage of semiconductor device fabrication: the block of semiconductor material is encapsulated in a supporting case to prevent physical damage and corrosion. The case, the "package", must support electrical contacts to connect the IC to a circuit board.
In the integrated circuit industry, the process is often referred to as packaging. Other names include semiconductor device assembly, assembly, encapsulation or sealing.
Any word you use to describe the process, it's hard work so not every flash storage brand does packaging. BIWIN experts have more than 25-years of experience in packaging and in projects covering custom or off-the-shelf solutions from dozens of industries.
The packaging stage is always followed by testing of the integrated circuit: also an important service that BIWIN excels in, especially on custom projects.
Solid-state flash storage demands a specialized understanding which is why there are so few manufacturers in the world compared to other computer technologies. The range of technical knowledge required covers components, hardware, materials, coatings, software, firmware, power, data security, conductivity and more.
Here are a few of our many technology features: