Solutions in storage technology

Applications

BIWIN offers storage solutions for many applications throughout many industries — and Industry 4.0 can also count on our experience for their special industrial applications. You can find BIWIN embedded solutions in many of the most famous devices that define our digital era. Customers appreciate the "win-win" philosophy that drives our solutions business.

FOR PERSONAL USE

Smart wearables

Companies, from giants to upstarts, look to launch new functionalities for consumer health and wellness wearable devices-- and BIWIN embedded memory chips bring better mobile performance.

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We're happy you are interested in our products and services. Please fill in this quick form to DOWNLOAD this BIWIN document. Feel free to contact us for any further questions about storage or memory solutions for your own industry.

    FOR ESPORTS

    eSports & Gaming

    BIWIN storage solutions bring the speed, stability and durability necessary to compete successfully at all levels of gaming.

    Download your free Industry Solutions Guide (ISGTM)

    We're happy you are interested in our products and services. Please fill in this quick form to DOWNLOAD this BIWIN document. Feel free to contact us for any further questions about storage or memory solutions for your own industry.

      FOR BUSINESS

      Enterprise servers & data centers

      Customers count on BIWIN’s expertise and optimized firmware algorithms to provide high-speed and high-reliability server storage solutions for their heavy applications.

      Download your free Industry Solutions Guide (ISGTM)

      We're happy you are interested in our products and services. Please fill in this quick form to DOWNLOAD this BIWIN document. Feel free to contact us for any further questions about storage or memory solutions for your own industry.

        FOR INDUSTRIAL

        Vehicle-mounted
        multimedia technology

        Automotive electronics and rail transit projects which need product definition, special storage algorithms or firmware, hardware design, packaging manufacturing, or safety regulation guidance can benefit from BIWIN experience.

        Download your free Industry Solutions Guide (ISGTM)

        We're happy you are interested in our products and services. Please fill in this quick form to DOWNLOAD this BIWIN document. Feel free to contact us for any further questions about storage or memory solutions for your own industry.

          FOR DEVELOPERS

          Embedded
          applications

          From consumer electronics to industrial automation (and other industries), embedded storage can be complex enough to require a highly customized service. Bring us your storage problems, and we’ll help you find the best solutions.

          Download your free Industry Solutions Guide (ISGTM)

          We're happy you are interested in our products and services. Please fill in this quick form to DOWNLOAD this BIWIN document. Feel free to contact us for any further questions about storage or memory solutions for your own industry.

            FOR EXTREMES

            Special industrial
            applications

            When you have an extreme or demanding environment (even mining or chemical industries), BIWIN’s special industrial application storage solutions will solve your problems one after another.

            Download your free Industry Solutions Guide (ISGTM)

            We're happy you are interested in our products and services. Please fill in this quick form to DOWNLOAD this BIWIN document. Feel free to contact us for any further questions about storage or memory solutions for your own industry.

              Packaging Type

              BIWIN offers many types of IC packaging, including BGA, SIP, LAG, QFN, TSOP and more.

              Integrated circuit packaging is the final stage of semiconductor device fabrication: the block of semiconductor material is encapsulated in a supporting case to prevent physical damage and corrosion. The case, the "package", must support electrical contacts to connect the IC to a circuit board.

              In the integrated circuit industry, the process is often referred to as packaging. Other names include semiconductor device assembly, assembly, encapsulation or sealing.

              Any word you use to describe the process, it's hard work so not every flash storage brand does packaging. BIWIN experts have more than 25-years of experience in packaging and in projects covering custom or off-the-shelf solutions from dozens of industries.

              The packaging stage is always followed by testing of the integrated circuit: also an important service that BIWIN excels in, especially on custom projects.

              Design considerations

              BGA

              Requiring advanced packaging technology, Ball Grid Array (BGA) involves a sphere-shapes solder ball lined up in array shape as terminal at the package bottom. Wire bonding and the flip-chip joins between Multiple core and interposer, sealed with resin. A BGA can provide more interconnection pins as well as high density of pins.

              SiP

              SiP (System in Package) integrates multiple functional chips (including processors, memory and other functional chips) into one package. SiP packaging lets us integrate multiple IC, packaging and testing technologies to create highly integrated products with optimal cost, scale and performance.

              Technical features

              Solid-state flash storage demands a specialized understanding which is why there are so few manufacturers in the world compared to other computer technologies. The range of technical knowledge required covers components, hardware, materials, coatings, software, firmware, power, data security, conductivity and more.

              Here are a few of our many technology features: