Applications
BIWIN offers storage solutions for many applications throughout many industries — and Industry 4.0 can also count on our experience for their special industrial applications. You can find BIWIN embedded solutions in many of the most famous devices that define our digital era. Customers appreciate the "win-win" philosophy that drives our solutions business.
FOR PERSONAL USE
Smart wearables
Companies, from giants to upstarts, look to launch new functionalities for consumer health and wellness wearable devices-- and BIWIN embedded memory chips bring better mobile performance.
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FOR ESPORTS
eSports & Gaming
BIWIN storage solutions bring the speed, stability and durability necessary to compete successfully at all levels of gaming.
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FOR BUSINESS
Enterprise servers & data centers
Customers count on BIWIN’s expertise and optimized firmware algorithms to provide high-speed and high-reliability server storage solutions for their heavy applications.
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FOR INDUSTRIAL
Vehicle-mounted
multimedia technology
Automotive electronics and rail transit projects which need product definition, special storage algorithms or firmware, hardware design, packaging manufacturing, or safety regulation guidance can benefit from BIWIN experience.
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We're happy you are interested in our products and services. Please fill in this quick form to DOWNLOAD this BIWIN document. Feel free to contact us for any further questions about storage or memory solutions for your own industry.
FOR DEVELOPERS
Embedded
applications
From consumer electronics to industrial automation (and other industries), embedded storage can be complex enough to require a highly customized service. Bring us your storage problems, and we’ll help you find the best solutions.
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We're happy you are interested in our products and services. Please fill in this quick form to DOWNLOAD this BIWIN document. Feel free to contact us for any further questions about storage or memory solutions for your own industry.
FOR EXTREMES
Special industrial
applications
When you have an extreme or demanding environment (even mining or chemical industries), BIWIN’s special industrial application storage solutions will solve your problems one after another.
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We're happy you are interested in our products and services. Please fill in this quick form to DOWNLOAD this BIWIN document. Feel free to contact us for any further questions about storage or memory solutions for your own industry.
Packaging Type
BIWIN offers many types of IC packaging, including BGA, SIP, LAG, QFN, TSOP and more.
Integrated circuit packaging is the final stage of semiconductor device fabrication: the block of semiconductor material is encapsulated in a supporting case to prevent physical damage and corrosion. The case, the "package", must support electrical contacts to connect the IC to a circuit board.
In the integrated circuit industry, the process is often referred to as packaging. Other names include semiconductor device assembly, assembly, encapsulation or sealing.
Any word you use to describe the process, it's hard work so not every flash storage brand does packaging. BIWIN experts have more than 25-years of experience in packaging and in projects covering custom or off-the-shelf solutions from dozens of industries.
The packaging stage is always followed by testing of the integrated circuit: also an important service that BIWIN excels in, especially on custom projects.
Design considerations
- Electrical — the structure and materials must prioritize signal transmission properties.
- Mechanical, thermal — packaging needs to be strong, resist moisture, dissipate heat, and shield against EM interference.
- Economic — the smaller, more complex the package, the more expensive it usually is to make.
BGA
Requiring advanced packaging technology, Ball Grid Array (BGA) involves a sphere-shapes solder ball lined up in array shape as terminal at the package bottom. Wire bonding and the flip-chip joins between Multiple core and interposer, sealed with resin. A BGA can provide more interconnection pins as well as high density of pins.
SiP
SiP (System in Package) integrates multiple functional chips (including processors, memory and other functional chips) into one package. SiP packaging lets us integrate multiple IC, packaging and testing technologies to create highly integrated products with optimal cost, scale and performance.
Technical features
Solid-state flash storage demands a specialized understanding which is why there are so few manufacturers in the world compared to other computer technologies. The range of technical knowledge required covers components, hardware, materials, coatings, software, firmware, power, data security, conductivity and more.
Here are a few of our many technology features:
- V-REC — our special firmware tuning for storage-intensive industries such as video surveillance, streaming media, graphics workstations and more.
- Temperature Protection — our thermal sensor design with S.M.A.R.T. utility, an intelligent temperature control technology.
- Firmware Backup — BIWIN can back up multiple firmware versions in different flash locations. When one firmware is damaged, the system automatically recognizes and starts the backup version.
- Physical Destruction — uses high voltage and high current to destroy each flash and master.
- Anti-Vulcanization Technology — for high temperature, high humidity, high pollution and high sulfur environments.
- Conformal Coating — our triple anti-varnish coating offers insulation, damp proofing, dust proofing and corrosion proofing.
- 30µ Gold-Plated Contacts — used in special industrial environments with extreme temperatures.