• Products
    • SSD
    • DRAM Module
    • Memory Card
    • Embedded
  • Solutions
    • Embedded
    • Industrial
    • PC OEM
    • Automotive
  • Assembly & Test
    • System-in-Package (SiP)
    • Processes & Capabilities
    • Product Services
    • Lab Services
  • Consumer Storage
    • Biwin Storage
    • Predator Storage
    • Acer Storage
    • HP Storage
    • Lenovo Storage
  • News
    • News Room
    • Yottabyte Era
  • Support
    • About Us
    • Event Calendar
    • Contact Us
  • Products
    • SSD
    • DRAM Module
    • Memory Card
    • Embedded
  • Solutions
    • Embedded
    • Industrial
    • PC OEM
    • Automotive
  • Assembly & Test
    • System-in-Package (SiP)
    • Processes & Capabilities
    • Product Services
    • Lab Services
  • Consumer Storage
    • Biwin Storage
    • Predator Storage
    • Acer Storage
    • HP Storage
    • Lenovo Storage
  • News
    • News Room
    • Yottabyte Era
  • Support
    • About Us
    • Event Calendar
    • Contact Us
  • 简体中文
  • 繁體中文
  • English
Get in Touch

DRAM Module

Optimized DRAM modules that deliver high-efficiency, low-latency memory performance across diverse devices and industries

Home > Products > DRAM Module
Show Filters
Search

Product Grade

DIMM Type

Capacity

Operating Temperature

  • DDR5 SODIMM

    DDR5 SODIMM

    Data Rate Up to 5600 MT/s
    Low Power Consumption
    Dual 32-Bit Sub-Channels
    Learn More
    Read more
  • DDR4 UDIMM

    DDR4 UDIMM

    Data Rate Up to 3200 MT/s
    Low Power Consumption
    Broad Compatibility
    Learn More
    Read more
  • LPDDR5 CAMM2 (LPCAMM2)

    LPDDR5 CAMM2 (LPCAMM2)

    Data Rate Up to 7500 MT/s
    Smaller Size for Thinner Devices
    Higher Power Efficiency
    Learn More
    Read more
  • DDR5 UDIMM

    DDR5 UDIMM

    Data Rate Up to 5600 MT/s
    Low Power Consumption
    Dual 32-Bit Sub-Channels
    Learn More
    Read more
  • DDR4 SODIMM

    DDR4 SODIMM

    Data Rate Up to 3200 MT/s
    4 GB–32 GB Capacity Options
    Wide Compatibility
    Learn More
    Read more
  • DDR4 ECC SODIMM

    DDR4 ECC SODIMM

    Reliable in Harsh Conditions
    Industrial-Grade Testing
    Customizable for Applications
    Learn More
    Read more
  • Products
    • SSD
    • Memory Card
    • DRAM Module
    • Embedded
  • Solutions
    • Embedded
      • Smart Wearables
      • Tablet
      • Wireless Communication
      • Commercial Display
      • Robot Vacuums
      • Voice Recorder
    • Industrial
      • Industrial Automation
      • Security Surveillance
      • Electric Power
      • Smart Healthcare
    • Automotive
      • Automotive Electronics
    • PC OEM
      • PC OEM
  • Assembly & Test
    • System-in-Package (SiP)
      • What is Semiconductor Packaging and Testing?
    • Processes & Capabilities
      • Wafer Preparation
      • Chip Interconnection and Protection
      • Package Assembly
      • Testing and Verification
    • Product Services
      • Wire Bonding Ball Grid Array (WB-BGA)
      • Flip-Chip Ball Grid Array (FC-BGA)
      • Flip Chip-Chip Scale Package (FCCSP)
      • Land Grid Array (LGA)
      • Thin Small Outline Package (TSOP)
    • Lab Services
      • Failure Analysis (FA)
      • Reliability Testing
      • Environmental Testing
  • Consumer Storage
    • Biwin Storage
    • Predator Storage
    • Acer Storage
    • Lenovo Storage
    • HP Lenovo
  • Support
    • About Us
    • Contact Us
    • Download
    • Event Calendar
    • News
  • Products
    • SSD
    • Memory Card
    • DRAM Module
    • Embedded
  • Solutions
    • Embedded
      • Smart Wearables
      • Tablet
      • Wireless Communication
      • Commercial Display
      • Robot Vacuums
      • Voice Recorder
    • Industrial
      • Industrial Automation
      • Security Surveillance
      • Electric Power
      • Smart Healthcare
    • Automotive
      • Automotive Electronics
    • PC OEM
      • PC OEM
  • Assembly & Test
    • System-in-Package (SiP)
      • What is Semiconductor Packaging and Testing?
    • Processes & Capabilities
      • Wafer Preparation
      • Chip Interconnection and Protection
      • Package Assembly
      • Testing and Verification
    • Product Services
      • Wire Bonding Ball Grid Array (WB-BGA)
      • Flip-Chip Ball Grid Array (FC-BGA)
      • Flip Chip-Chip Scale Package (FCCSP)
      • Land Grid Array (LGA)
      • Thin Small Outline Package (TSOP)
    • Lab Services
      • Failure Analysis (FA)
      • Reliability Testing
      • Environmental Testing
  • Consumer Storage
    • Biwin Storage
    • Predator Storage
    • Acer Storage
    • Lenovo Storage
    • HP Lenovo
  • Support
    • About Us
    • Contact Us
    • Download
    • Event Calendar
    • News
BIWIN produces high quality NAND flash storage and is now known in embedded, consumer, corporate and industrial segments for its independent development capabilities in hardware, software, firmware and storage algorithms.
  • Privacy Policy
  • Terms of Conditions

©BIWIN STORAGE TECHNOLOGY CO., LTD.

Product Comparison

You can add to 3 product or View the product selected
Compare Now
    Hide Show