Embedded Chips

With the increasing development of smartphone operating systems and applications, mobile phones have higher requirements for larger storage capacity. BIWIN’s eMCP is based on MCP (Multi-Chip Packaging), which integrates an eMMC chip and a low-power DRAM into one IC package. It effectively simplifies the manufacturing process, reduces the development cost of customers’ products, and shortens the production cycle, speeding up the new product launch process.