Shenzhen, China, March 1st, 2023– During Embedded World 2023 (March 14-16, Nuremberg, Germany) BIWIN will show its cutting-edge embedded and industrial memory solutions in Hall 1, Stand 241 to meet the needs of today’s most demanding applications in PC, industrial automation, in-vehicle, server, and smart mobile terminal industries.
Several of the popular solutions on the BIWIN stand in Hall 1 will include:
Embedded Memory: With up to 1 TB capacity, the BIWIN PCIe Gen4 BGA SSD EP400 comes with high-speed PCIe 4.0 x 2 to deliver up to 3500 MB/s read and 3300 MB/s write– with dimensions of just 11.5 mm (L) x 13 (W) mm. Coupled with LPDDR4X, this BIWIN EP400 can run at speeds up to 4266 Mbps with a capacity up to 64 GB.
With the anticipated demand in 2023 (and beyond) for ARM in servers, PCs, and mobile devices, BIWIN anticipates a great reception to its lines of BGA SSD solutions built to improve performance with ARM servers and ARM-embedded devices including gaming smartphones, ultra-thin laptops, automotive, and smart industrial equipment.
Embedded Memory: BIWIN LPDDR5 supports multi-bank architectures to enable multi-channel data transmission, further increasing the data rates from 4266 Mbps to 6400 Mbps, and boosting the bandwidth from 34 GB/s to 51 GB/s.
It adopts dynamic voltage scaling to reduce power consumption by 30%. In addition, BIWIN LPDDR5 adds Data Copy and Write-X technologies to speed up data transmission.
Enterprise Server: BIWIN SSD SS321 is a pioneering product built with 3D NAND wafer bundled with SATA 6 Gbps interface and DDR4 external DRAM cache, delivering a maximum sequential 560 MB/s read and 500 MB/s write. It has three volume options: 240 GB, 480 GB, and 960 GB.
Made with cutting-edge hardware design, firmware development, packaging & testing, and manufacturing process, these products sport excellent performance, high reliability, reliable security, low power consumption, and more.
In-vehicle: BIWIN C1008 is specially manufactured for in-vehicle surveillance systems and DVR (Digital Video Recorders). Crafted with 3D TLC flash, BIWIN C1008 is available in 500 GB, 960 GB, 1.92 TB, and 3.84 TB.
It provides stable reading and writing, more than 3000 P/E cycles, “firmware algorithm + tantalum capacitor” dual power failure protection, wide temperature technology: all of which enable a smooth and stable workflow even when work is input-intensive.
DDR5 Memory: BIWIN DDR5 UDIMM is a low-power consumption, a high-performance memory module that fully conforms to JEDEC’s 288-pin DDR5. BIWIN DDR5 UDIMM integrates power efficiency, wide operating temperature range, and high capacity to deliver an unparalleled transfer rate up to 4800 MT/s. Strictly screened DRAM ICs are used to ensure stable operation and excellent compatibility, making this product the best choice for industrial control, security and protection, desktop PCs, and more.
DDR5 Memory: BIWIN DDR5 SODIMM is a low-power, high-performance product that fully conforms to JEDEC’s 262-pin DDR5 small-size memory module. This series uses a working voltage of 1.1 V and operates with an applicable operating temperature range from 0℃ to 85℃. With a capacity range of 16 GB – 32 GB and up to 4800 MT/s data transfer speed, DDR5 SODIMM suits computer and gaming laptops, NUCs, thin clients, security and protection devices, and more.
Meet BIWIN at Embedded World 2023 and check out BIWIN’s industry-leading products featuring strong performance, lower power consumption, great reliability, and larger capacity to meet your storage needs.
BIWIN Storage Technology Company Limited produces high-quality flash storage and is now known in embedded, consumer, corporate and industrial segments for its independent development capabilities in hardware, software, firmware, and storage algorithms.
BIWIN’s experience in production (along with its complete packaging, testing, and production lines) ensures BIWIN products are superior in performance, earning BIWIN many awards and a reputation for providing global customers with high-quality storage products.
In 2022, the company opened its latest facility, BIWIN Huizhou Science and Technology Zone, with a state-of-the-art 110,000 m2 facility.
Our founders started in the flash storage business in Shenzhen, China in 1995, embracing the “WIN-WIN” business philosophy that would later become a hallmark for BIWIN. In 2009 they made a key decision for the business: to add IC encapsulation (IC packaging process) into the factory. A remarkable milestone that the vast majority of competing companies still don’t have (they outsource the process or buy the packaged IC packaged), this successful step led to the 2010 creation of the company we know today: BIWIN Storage Technology Company.
After a successful IPO, BIWIN is now listed on the Shanghai Stock Exchange, STAR Market on the Sci-tech Innovation Board. Stock Symbol: 688525.
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