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BIWIN’s IPC A Series is built for entry-level industrial control. The A Series offers cacheless and cost-effective solutions for industrial control applications with optimized firmware algorithms and hardware circuit design to ensure the reliability and long-term operational stability.

BIWIN uses its own exclusive memory testing technology to provide a series of DRAM products for long-term use with high stability, wide compatibility, high read-write performance, and excellent compatibility with mainstream computing platform solutions.

The latest generation of DDR, with a new architecture for a big jump in performance.

eMMC is an embedded non-volatile memory system (flash memory and controller) that frees the host processor from low-level flash memory management. For product developers, this simplifies the application interface design and qualification process to reduce the time-to-market. Designed for a wide range of applications (consumer electronics, mobile phones, handheld computers, navigational systems, etc), the small BGA package sizes and low power consumption make eMMC an excellent low-cost memory solution for any space-constrained applications such as mobile devices.

With the increasing development of smartphone operating systems and applications, mobile phones have higher requirements for larger storage capacity. BIWIN’s eMCP is based on MCP (Multi-Chip Packaging), which integrates an eMMC chip and a low-power DRAM into one IC package.

BIWIN ePOP combines eMMC and Mobile LPDDR in one package with optional capacities. ePOP is widely used in applications in mobile and wearables. With the leading wafer packaging technology (advanced wafer grinding, lamination and wirebonding), BIWIN integrates RAM and ROM in a device.

This is a next-generation mobile storage solution based on UFS and LPDDR4. It offers compact construction (so your smart devices can be even smaller) and excellent performance.

Solving the higher cost of mobile storage with NAND flash with an LPDDR2/3 solution, nMCP features a smaller size, higher capacities, and lower power consumption. By stacking the NAND flash and using low-power SRAM, we release more PCB space.

Our ball-grid-array (BGA) embedded SSD technology packs NAND flash, DRAM memory, and a controller chip into a package that weighs less than half a penny and is smaller than a postage stamp.