Shenzhen, China, March10th, 2024— BIWIN announces its participation in the Embedded World Exhibition 2024 in Nürnberg, Germany, from April 9th to 11th. This premier event stands as the globe’s most extensive exhibition for embedded technologies, attracting over 32,000 visitors and 1,000 exhibitors from various sectors including embedded, industrial, and mobile.
BIWIN will be located in Hall 1, Stand 140, showcasing our latest innovations in embedded and industrial memory solutions. Our featured products include:
- Industrial:Our GS30 series, SD CSD200, microSD TF200, and industrial eMMC are designed for demanding industrial applications. BIWIN leverages its expertise in storage solution development and advanced testing to offer industry-specific customization services, tailoring storage devices to meet unique requirements in performance, stability, security, robustness, and durability.
- LPDDR 4X ePOP: Now officially certified for the Qualcomm 5100 SOC platform, BIWIN LPDDR4X ePOP integrates eMMC 5.1 and LPDDR4X in a compact dimension of 8 mm x 9.5 mm x 0.8 mm, delivering ROM sequential read and write speeds of up to 310 MB/s and 240 MB/s With RAM frequency up to 4266 MHz and capacity up to 32 GB + 16 Gb (with a 64 GB+16 Gb version coming soon), BIWIN ePOP is a flagship storage solution for high-end smart watches.
- PC OEM SSD: Our SATA SSDs and PCIe SSDs offer high-speed storage solutions. As next-generation storage solutions, our PCIe SSDs are engineered to meet the demands of modern computing environments with the PCIe Gen4 x 4 interface, delivering unmatched performance and large capacity options for a broad range of PC configurations.
- Enterprise SSD: Introducing the SS621 which sets new standards for enterprise storage. With capacities from 480 GB to 7.68 TB and a DWPD rating of >=1, BIWIN SS621 SATA SSD promises durability and consistent performance. It distinguishes itself with robust performance, low power consumption of just 2.75 W, and broad hardware compatibility.
- PC OEM Memory:Our portfolio of PC OEM memory modules encompasses a comprehensive range of DDR4 and DDR5 technologies tailored to meet the evolving demands of modern computing.
BIWIN ensures compatibility and peak performance for desktops, laptops, gaming systems, and industrial applications. The BIWIN innovative memory solutions support the next generation of high-performance computing, gaming, and industrial devices.
About BIWIN STORAGE TECHNOLOGY
BIWIN Storage Technology Company Limited produces high-quality flash storage and is now known in embedded, consumer, corporate and industrial segments for its independent development capabilities in hardware, software, firmware, and storage algorithms. BIWIN’s experience in production (along with its complete packaging, testing, and production lines) ensures BIWIN products are superior in performance, earning BIWIN many awards and a reputation for providing global customers with high-quality storage products. The company has opened its latest facility, BIWIN Huizhou Science and Technology Zone, a state-of-the-art 110,000 m2 facility. Our founders started in the flash storage business in Shenzhen, China in 1995, embracing the “WIN-WIN” business philosophy that would later become a hallmark for BIWIN. In 2009 they made a key decision for the business: to add IC encapsulation (IC packaging process) into the factory. A remarkable milestone that most competing companies still don’t have (they outsource the process or buy the packaged IC), this successful step led to the 2010 creation of the company we know today: BIWIN Storage Technology Company. After a successful IPO, BIWIN is now listed on the Shanghai Stock Exchange, the prestigious STAR Market on the Sci-tech Innovation Board. Stock Symbol: 688525.
To learn more about BIWIN, visit https://biwintechnology.com or contact us at mkt.hq@biwintech.com.