BIWIN Storage Technology Co., Ltd. (“BIWIN”) will exhibit its groundbreaking innovation, the Mini SSD, at the Embedded World 2025. Visitors to Booth #1-140 can experience firsthand how BIWIN is pushing the boundaries of storage technology, with the Mini SSD leading the way in high-performance, compact solutions for mobile devices, edge computing, and beyond.
Innovative Compact Design: Power in a Small Package
The BIWIN Mini SSD features an advanced LGA (Land Grid Array) packaging technology that integrates the controller and flash memory modules into an ultra-compact form. Measuring just 15.0 mm × 17.0 mm × 1.4 mm—about half the size of a Euro coin and about the size of a microSD card—this Mini SSD delivers a remarkable leap in performance and storage capacity.
The new form factor and modular slot design introduce a new flexibility for engineering design-in, enabling easy plug-and-play functionality. This versatile design ensures broad compatibility with a wide range of devices, including laptops, tablets, smartphones, cameras, NAS systems, smart albums, and portable SSDs.
Exceptional Performance: Speed and Efficiency
If you really need speed in an ultra-compact form factor, the Mini SSD is your best choice.
Powered by PCIe Gen4x2 and the NVMe 1.4, the BIWIN Mini SSD incorporates 3D TLC NAND technology to achieve impressive read speeds up to 3700 MB/s and write speeds up to 3400 MB/s. The Mini SSD is designed to handle the speed demands of mobile devices, edge computing, and other data-intensive applications.
Available in capacities ranging from 512 GB to 2 TB, this product ensures fast, efficient storage for demanding workloads such as cloud collaboration, file access, and real-time data processing.
BIWIN Mini SSD, with its exceptional speed and storage space, offers a new innovative solution for industries that require high speed, high performance, and high durability storage to handle mission-critical workloads at scale.
Strength in Storage, Designed for Durability
BIWIN Mini SSD stands at the forefront of high-performance storage solutions, designed to meet the rigorous demands of critical applications. Combining cutting-edge packaging technology with advanced materials, it provides exceptional resistance to shock, vibration, and environmental factors. With an IP68 rating for dust and water protection, the Mini SSD is built to endure even in the harshest conditions.
Its robust LGA packaging ensures a secure, direct electrical and mechanical connection, reinforcing the drive’s durability and stability in high-impact environments. Capable of surviving drops from up to 3 meters, the Mini SSD guarantees reliable operation in both industrial and outdoor settings.
BIWIN Mini SSD incorporates advanced firmware technologies, including dynamic SLC caching, wear leveling, TRIM, and garbage collection, to ensure optimal performance and data reliability. These features work together to maintain consistent write speeds, prolong the lifespan of the drive, and prevent data fragmentation.
Meet BIWIN at Embedded World 2025
BIWIN will showcase its cutting-edge storage solutions at this year’s Embedded World. Meet us at Booth #1-140, and get an in-depth look at how BIWIN’s innovative storage technology is shaping the future of compact, high-performance solutions. Discover how the Mini SSD is transforming data storage with its exceptional speed, ultra-compact form factor, and wide compatibility across many different devices and applications.
About BIWIN
BIWIN Storage Technology CO., Ltd. (SSE STAR Market, Stock Symbol: 688525) produces high quality NAND flash storage and is known in embedded, consumer, corporate and industrial segments for its independent development capabilities in hardware, software, firmware and storage algorithms.
Our founders started in the flash storage business in 1995, in Shenzhen, China, embracing the “WIN-WIN” business philosophy that would later become the hallmark for BIWIN.
In 2009, they made a key decision for the business: to add IC encapsulation (or IC packaging) process into the factory. A remarkable milestone that the vast majority of competing companies still don’t have (they outsource the process or buy the packaged IC). This successful step led to the 2010 creation of the company we know today.
For more information about BIWIN, please visit www.biwintechnology.com.