During Embedded World 2025, BIWIN Storage Technology Co., Ltd. (“BIWIN”) will feature advanced solutions for embedded systems, automotive and industrial applications, and enterprise devices.
As embedded storage becomes the backbone of modern computing, BIWIN’s solutions are at the forefront of this evolution addressing the ever-growing demand for smaller, faster, more reliable, more energy-efficient and more durable storage solutions.
At this year’s Embedded World Booth #1-140, BIWIN will show a wide range of innovative solutions but will highlight two standout products to showcase BIWIN’s capabilities in addressing different markets within the embedded storage landscape.
Fast, Durable eMMC for Industrial, Data-Intensive Applications
BIWIN Industrial Wide-Temperature eMMC TGE208 & TGE218 focus on high-demand industrial applications where reliability, endurance, and energy efficiency are crucial. Built to withstand harsh environments, the eMMC features a very wide operating temperature range of -40°C to 85°C for stable operation even in extreme conditions.
With sequential read speeds up to 320 MB/s and write speeds up to 230 MB/s, the eMMC is optimized for fast and efficient data transfer, allowing it to handle large files and support real-time data processing with ease. BIWIN’s firmware optimization with pSLC (Pseudo SLC) technology further enhances performance, significantly improving speed, reliability, and endurance.
BIWIN LPDDR5X: Compact, Powerful Storage for Embedded Applications
The BIWIN LPDDR5X is tailored for applications that demand exceptional speed and high-bandwidth memory solutions with data transfer rates up to 8533 Mbps. The 496-ball LPDDR5X is a high-performance, low-power memory designed for next-gen smart devices, optimized for demanding environments like 5G, AI, and automotive applications.
The 16 GB memory chip with 8 stacked dies achieves a thickness of just 0.71 mm, while maintaining outstanding resistance to warping and three-point bending. Incorporating Dynamic Voltage and Frequency Scaling (DVFS), it automatically adjusts power consumption based on workload to provide significant energy savings. Delivering exceptional bandwidth while maintaining an optimal balance between performance, power efficiency, and size, the LPDDR5X is the ideal memory solution for high-end mobile devices.
Meet BIWIN at Embedded World 2025
Explore the future of embedded, automotive and industrial, and enterprise storage solutions with BIWIN at Embedded World 2025. Visit us at Booth #1-140 to explore our comprehensive range of high-performance storage solutions, meticulously engineered for reliability. BIWIN: We’re empowering next-generation storage solutions for a smarter, connected world.
About BIWIN
BIWIN Storage Technology CO., Ltd. (SSE STAR Market, Stock Symbol: 688525) produces high quality NAND flash storage and is known in embedded, consumer, corporate and industrial segments for its independent development capabilities in hardware, software, firmware and storage algorithms.
Our founders started in the flash storage business in 1995, in Shenzhen, China, embracing the “WIN-WIN” business philosophy that would later become the hallmark for BIWIN.
In 2009, they made a key decision for the business: to add IC encapsulation (or IC packaging) process into the factory. A remarkable milestone that the vast majority of competing companies still don’t have (they outsource the process or buy the packaged IC). This successful step led to the 2010 creation of the company we know today.
For more information about BIWIN, please visit www.biwintechnology.com.