BIWIN, a leading force in the memory and storage solutions, is excited to announce its participation in the upcoming FMS: the Future of Memory and Storage, Santa Clara Convention Center, California, August 5-7, 2025.
BIWIN will be showcasing its latest innovations at Booth #619, featuring cutting-edge products including high-performance industrial SSDs, advanced OEM solutions, and embedded memory solutions.
As industries become more connected and data-driven, the need for reliable and flexible storage solutions has intensified. Engineered for performance and long-term reliability, our solutions help businesses enhance operational efficiency, innovate faster, and stay competitive in an increasingly data-centric world.
ePOP LPDDR4X: A compact eMMC 5.1 + LPDDR4X solution, measuring just 8.00 x 9.50 mm, ideal for ultra-constrained spaces like wearables, medical monitors, and AR/VR systems. The tightly integrated package shortens signal paths between storage, memory, and SoC, enabling high-speed data transmission with low latency and reduced power consumption. Perfect for Edge AI use cases where real-time responsiveness and low energy profiles are critical, the BIWIN ePOP LPDDR4X supports the growing demand for powerful, low-power processing in minimal form factors.
LPDDR5X: High-speed LPDDR5X memory delivers up to 8533 Mbps and 68 GB/s bandwidth, while consuming 25% less power than LPDDR4X. Designed for 5G smartphones, Edge AI modules, automotive vision systems, and premium tablets, it keeps pace with compute-heavy SoCs by ensuring low-latency, high-frequency access across tasks. Advanced signal integrity and robust packaging ensure stability even in high-vibration or thermally dynamic environments, making it a top choice for performance-critical embedded designs.
From smart factories to transportation systems and edge computing nodes, BIWIN’s industrial-grade PCIe SSD portfolio delivers consistent performance, providing smooth, low-latency access to large datasets. With robust error correction, wear-leveling, and selected models rated for ≥3000 P/E cycles, the lineup is designed to endure heavy write workloads over extended lifecycles. Wide-temperature support ensures stability from control cabinets to outdoor enclosures. Compact form factors offer flexible integration, while custom firmware options enable application-specific tuning for power loss protection, thermal behavior, host compatibility, and more.
BIWIN OEM SSD solutions deliver tailored, high-performance storage for embedded systems and industrial applications, moving beyond one-size-fits-all approaches. These SSDs are designed to meet specific requirements through flexible configuration options, including capacity, thermal design, and firmware customization, enabling optimization for target performance profiles, power management schemes, and security features. All products undergo strict compatibility testing and controlled production processes to ensure batch-to-batch consistency and long-term supply stability. Widely adopted in commercial PCs, industrial terminals, digital signage systems, retail devices, and AIoT edge platforms, BIWIN OEM SSDs provide the performance, efficiency, and form factor versatility required for modern system design.
Experience firsthand how our innovations can transform data storage in mission-critical applications. We welcome the opportunity to discuss how BIWIN’s cutting-edge storage technologies can drive operational efficiency, enhance data management, and support your business’s long-term objectives.
BIWIN Storage Technology CO., Ltd. (SSE STAR Market, Stock Symbol: 688525) produces high-quality NAND flash storage solutions and is known in embedded, consumer, corporate and industrial segments for its independent development capabilities in hardware, software, firmware and storage algorithms.
Our founders started in the flash storage business in 1995, in Shenzhen, China, embracing the “WIN-WIN” business philosophy that would later become the hallmark for BIWIN.
In 2009, they made a key decision for the business: to add IC encapsulation (or IC packaging) process into the factory. A remarkable milestone that the vast majority of competing companies still don’t have (they outsource the process or buy the packaged IC). This successful step led to the 2010 creation of the company we know today.
Leading the Future of Storage and Memory with Cutting-Edge Solutions. Infinite Storage, Unlimited Solutions
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